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Thermal - Pads
AF200-505005 Picture

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AF200-505005

  • CUI Devices
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  • THERMAL INTERFACE MATERIAL, AF20
  • Datasheet download
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In Stock:17,586(Ref. price)
Qty.Unit PriceExt. Price
1
$17.05468
$17.05468
Documents
Specifications
DescriptionDetails
Series
AF200
Package
Sheet
Usage
-
Type
Pad, Sheet
Shape
Square
Outline
50.00mm x 50.00mm
Thickness
0.0197" (0.500mm)
Material
Non-Silicone
Adhesive
Tacky - Both Sides
Backing, Carrier
-
Color
White
Thermal Resistivity
-
Thermal Conductivity
2.0W/m-K
Other
Allok electronics franchised of  SAMXON/ ROYALOHM, strong at active & passive items: MLCC, TANT CAP, ECAP, Resistor, Inductor, crystal, filter for brands:

IC: STM, NXP, Infineon, ADi, Microchip, Atmel, FTDI, TJX
DC/DC converter : MURATA, AIMTEC, RECOM, PEAK, MORSUN, MEANWELL
MLCC: MURATA, SAMSUNG, YAGEO, TAIYO, TDK, JOHNASON  
TANT CAP: VISHAY, KEMET, AVX, EPCOS, ROHM,
ECAP: RUBYCON, SAMWHA, NICHICON, NIPPON, KAMCAP, CAPXON, JAMICON
Inductor/Filter/Beads: Murata, TAIYO, SUNLORD, FengHua

Crystal: EPSON, SEIKO, NDK KDS, HOSONIC, TXC

Opto/IR receiverCREE, OSRAM,  EVERLIGHT,  LITEON, VISHAY, HONEYWELL, AVAGO, KODENSHI.


Pls contact us if you need any items. Email: dorsey@aooktech.com  suya@aooktech.com

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