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Thermal - Heat Sinks
625-35AB Picture

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625-35AB

  • Wakefield-Vette
  • New
  • HEATSINK FOR 25MM BGA
  • Datasheet download
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In Stock:20,610(Ref. price)
Qty.Unit PriceExt. Price
1
$0.98046
$0.98046
Documents
Specifications
DescriptionDetails
Series
625
Package
Bulk
Type
Top Mount
Package Cooled
BGA
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Pin Fins
Length
0.984" (25.00mm)
Width
0.984" (25.00mm)
Diameter
-
Fin Height
0.350" (8.89mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
1.00°C/W @ 400 LFM
Thermal Resistance @ Natural
-
Material
Aluminum
Material Finish
Black Anodized
Other
ALLOK Technology franchised of  SAMXON/ ROYALOHM, strong at active & passive items: MLCC, TANT CAP, ECAP, Resistor, Inductor, crystal, filter for brands:

IC: STM, NXP, Infineon, ADi, Microchip, Atmel, FTDI, TJX
DC/DC converter : MURATA, AIMTEC, RECOM, PEAK, MORSUN, MEANWELL
MLCC: MURATA, SAMSUNG, YAGEO, TAIYO, TDK, JOHNASON  
TANT CAP: VISHAY, KEMET, AVX, EPCOS, ROHM,
ECAP: RUBYCON, SAMWHA, NICHICON, NIPPON, KAMCAP, CAPXON, JAMICON
Inductor/Filter/Beads: Murata, TAIYO, SUNLORD, FengHua

Crystal: EPSON, SEIKO, NDK KDS, HOSONIC, TXC

Opto/IR receiverCREE, OSRAM,  EVERLIGHT,  LITEON, VISHAY, HONEYWELL, AVAGO, KODENSHI.


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