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Thermal - Heat Sinks
BGAH190-090E Picture

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BGAH190-090E

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  • BGA HEATSINK W/TAPE
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In Stock:19,714(Ref. price)
Qty.Unit PriceExt. Price
1
$5.58600
$5.58600
Documents
Specifications
DescriptionDetails
Series
BG
Package
Box
Type
Top Mount
Package Cooled
BGA, CPU, GPU
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Angled Fins
Length
0.748" (19.00mm)
Width
0.748" (19.00mm)
Diameter
-
Fin Height
0.354" (9.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
4.50°C/W @ 200 LFM
Thermal Resistance @ Natural
-
Material
Aluminum Alloy
Material Finish
Black Anodized
Other
ALLOK Technology franchised of  SAMXON/ ROYALOHM, strong at active & passive items: MLCC, TANT CAP, ECAP, Resistor, Inductor, crystal, filter for brands:

IC: STM, NXP, Infineon, ADi, Microchip, Atmel, FTDI, TJX
DC/DC converter : MURATA, AIMTEC, RECOM, PEAK, MORSUN, MEANWELL
MLCC: MURATA, SAMSUNG, YAGEO, TAIYO, TDK, JOHNASON  
TANT CAP: VISHAY, KEMET, AVX, EPCOS, ROHM,
ECAP: RUBYCON, SAMWHA, NICHICON, NIPPON, KAMCAP, CAPXON, JAMICON
Inductor/Filter/Beads: Murata, TAIYO, SUNLORD, FengHua

Crystal: EPSON, SEIKO, NDK KDS, HOSONIC, TXC

Opto/IR receiverCREE, OSRAM,  EVERLIGHT,  LITEON, VISHAY, HONEYWELL, AVAGO, KODENSHI.


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