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Thermal - Heat Sinks
HSE-B2111-038 Picture

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HSE-B2111-038

  • CUI Devices
  • New
  • HEAT SINK, EXTRUSION, TO-220, 25
  • Datasheet download
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In Stock:18,784(Ref. price)
Qty.Unit PriceExt. Price
1
$0.44620
$0.44620
Documents
Specifications
DescriptionDetails
Series
HSE
Package
Box
Type
Board Level
Package Cooled
TO-220
Attachment Method
Bolt On
Shape
Rectangular, Fins
Length
0.984" (25.00mm)
Width
0.625" (16.00mm)
Diameter
-
Fin Height
0.354" (9.00mm)
Power Dissipation @ Temperature Rise
3.8W @ 75°C
Thermal Resistance @ Forced Air Flow
6.12°C/W @ 200 LFM
Thermal Resistance @ Natural
19.74°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
Other
Allok electronics franchised of  SAMXON/ ROYALOHM, strong at active & passive items: MLCC, TANT CAP, ECAP, Resistor, Inductor, crystal, filter for brands:

IC: STM, NXP, Infineon, ADi, Microchip, Atmel, FTDI, TJX
DC/DC converter : MURATA, AIMTEC, RECOM, PEAK, MORSUN, MEANWELL
MLCC: MURATA, SAMSUNG, YAGEO, TAIYO, TDK, JOHNASON  
TANT CAP: VISHAY, KEMET, AVX, EPCOS, ROHM,
ECAP: RUBYCON, SAMWHA, NICHICON, NIPPON, KAMCAP, CAPXON, JAMICON
Inductor/Filter/Beads: Murata, TAIYO, SUNLORD, FengHua

Crystal: EPSON, SEIKO, NDK KDS, HOSONIC, TXC

Opto/IR receiverCREE, OSRAM,  EVERLIGHT,  LITEON, VISHAY, HONEYWELL, AVAGO, KODENSHI.


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